Z690I AORUS ULTRA
THE NEW KING OF GAMING
Rule supreme with the Z690 AORUS gaming motherboards. The new king of gaming platform continues the legendary AORUS bloodline with the most robust power delivery and dominant thermal design, glorified with the complete memory overclocking technology to crown your PC with the best Alder Lake’s performance in all its gaming glory.
Direct Digital VRM Design
To ensure maximum Turbo Boost and overclocking performance of Intel's new generation CPU, GIGABYTE Z690 series equip the best VRM design ever built with the highest quality components.
The more advanced manufacturing process and the higher core count on the new generation of CPUs, requires motherboards to utilize a more sophisticated VRM design to make CPUs run at their full potential. GIGABYTE uses fully DIRECT VRM DESIGN, high quality MOSFETs and tantalum polymer capacitors to achieve higher efficiency, lower voltage ripple and lower temperature than traditional parallel VRM design.
Tantalum Polymer Capacitor
• Lower impedance than regular capacitor to reduce voltage ripple
• Stable capacitance under high temperature
• Mounted right under the CPU area to stabilize CPU voltage during heavy loading
PCIe 5.0 DESIGN
GIGABYTE Z690 Motherboards are ready to work with the upcoming PCIe 5.0 devices which are expected to experience double bandwidth than the current PCIe 4.0 devices. To reach the high speed and maintain good signal integrity, GIGABYTE R&D uses the low impedance PCB to provide the maximum performance.
Ultra Durable™ SMD PCIe 5.0 Armor
GIGABYTE' exclusive stainless steel shielding design.
Hybrid Cores Optimization
With new Intel Hybrid technology, GIGABYTE exclusively creates two new "CPU Upgrade" in BIOS profiles to meet different users’ scenarios by adjusting P-Core and E-Core activation and voltage policy.
Support for DDR5 XMP Up to 6200MHz and Beyond*
AORUS is offering a tested and proven platform that ensures proper compatibility with profiles up to 6200MHz and beyond. All users need to do to attain this performance boost is to ensure that their memory module is XMP capable and that the XMP function is activated and enabled on their AORUS motherboard.
M.2 Thermal Guard IIIM.2 Thermal Guard III design uses double-sided thermal pads to elevate the height of M.2 heatsink as increasing surface area to dissipate heats from M.2 SSDs. M.2 Thermal Guard III constructed with 5.6X optimized heat dissipation surface to prevent throttling and bottleneck that high-speed/ large capacity of PCIe 4.0 M.2 SSDs may cause, especially under heavy workload.
3% Cooler by implementing
2X copper PCB Design
By adopting 2X copper on PCB inner layer, it lowers the components' temperature at least 3% by turning the PCB into a super thin PCB size copper heatsink to dissipate the heat from the components effectively, due to it’s high thermal conductivity and lower impedance.
First adopter on 2.5 GbE LAN onboard
2X Faster than ever
Adoption of 2.5G LAN provide up to 2.5 GbE network connectivity, with at least 2 times faster transfer speeds compared to general 1GbE networking, perfectly designed for gamers with ultimate online gaming experience.
Support Multi-Gig(10/100/1000/2500Mbps) RJ-45 Ethernet
New Introduce Intel® WIFI 6 802.11ax + BT 5 Module
Intel Wireless solution supports 802.11ax, enables gigabit wireless performance, provides smooth video streaming, better gaming experience, few dropped connections and speeds up to 2.4Gbps*. Moreover, Bluetooth 5 provides 4X range over BT 4.2 and with faster transmission.
Benefit of WIFI 6
1. 5.5X throughput than 802.11ac 1x1*
2. 4X better network capacity, no traffic jams especially in those dense area with lots of devices
3. Network efficiency increase for better user experience